DIODE LASER-ASSISTED PYROLYSIS OF ORGANOMETALLIC FILMS FOR THE FABRICATION OF METALLIC CONDUCTORS ON POLYIMIDE

We have developed a simple, compact, and inexpensive diode laser-assis ted direct writing system for the fabrication of copper and gold inter connects on polyimide for repair and customization applications in the packaging industry. Gold-containing precursor films were prepared fro m a commercial organometallic solution. A thermochemical analysis of t he precursor was conducted in order to understand its decomposition pr ocess. The diode laser-assisted pyrolysis of the precursor films produ ced conductive gold lines on polyimide with widths ranging from 12 to 60 mu m, a thickness of 0.1 mu m, and a minimum resistivity of 30 mu O mega . cm. The deposits were annealed in air at 300 degrees C in order to induce the activation of the electroless plating of copper. Cu/Au conductors, 2-mu m thick, with an overall resistivity of 8 mu Omega . cm were obtained after a 45 min immersion in the plating bath. Prelimi nary results concerning the diode laser-assisted pyrolysis of copper-c ontaining organometallic films are also presented.