STEADY-STATE HEAT-CONDUCTION ANALYSIS FOR 2-TERMINAL MICROWAVE-OSCILLATOR DEVICES WITH RECTANGULAR INTEGRAL HEAT SINKS

The outline of a theoretical analysis to calculate the steady-state te mperature distribution within a rectangular prism mounted on a semi-in finite heat sink is presented. The incident heat flux is uniform over a given centralized circular region on one face of the prism. The ther mal conductivity of the material is treated as being dependent on the temperature. The model is used to calculate the maximum temperature ri se within a heat sink configuration that is used to package contempora ry two-terminal microwave oscillator devices. Results are presented th at show how the maximum temperature rise within such commercially avai lable heat sink packages depends on the input heat flux and the dimens ions and thermal conductivity of the materials. These results are pres ented in a generalized form for device design purposes.