Intergranular fracture and boron effect in Ni3Si (22.5 at% Si) were st
udied by tensile testing in various environments at room temperature.
Our results indicate that brittle grain-boundary fracture in Ni3Si is
caused by two major factors: (1) moisture-induced hydrogen embrittleme
nt, and (2) poor grain-boundary cohesion. Boron is found to segregate
strongly to grain boundaries and suppress environmental embrittlement
in Ni3Si. Boron, however, does not enhance the cohesive strength of th
e boundaries. As a result, Ni3Si showed a moderate increase iri room-t
emperature tensile ductility in moist air when doped with boron. Auger
analyses indicate that the silicon concentration at the grain boundar
ies is significantly lower than that in the bulk; however, there is no
indication of strong co-segregation of nicker and boron atoms to the
boundaries.