RELATIONSHIP BETWEEN THERMOELECTRIC PROPE RTIES AND MICROSTRUCTURE ONP-TYPE (BI2TE3)(0.25)(SB2TE3)(0.75) SYSTEM USING MILLED POWDER

Authors
TOKIAI T UESUGI T KOUMOTO K
Citation
T. Tokiai et al., RELATIONSHIP BETWEEN THERMOELECTRIC PROPE RTIES AND MICROSTRUCTURE ONP-TYPE (BI2TE3)(0.25)(SB2TE3)(0.75) SYSTEM USING MILLED POWDER, Nippon Seramikkusu Kyokai gakujutsu ronbunshi, 103(11), 1995, pp. 1182-1187
Citations number
22
Categorie Soggetti
Material Science, Ceramics
Journal title
Nippon Seramikkusu Kyokai gakujutsu ronbunshi → ACNP
ISSN journal
09145400
Volume
103
Issue
11
Year of publication
1995
Pages
1182 - 1187
Database
ISI
SICI code
0914-5400(1995)103:11<1182:RBTPRA>2.0.ZU;2-P
Abstract
We have developed p-type bismuth telluride of (Bi2Te3)(0.25)(Sb2Te3)(0 .75) system with modified PIES method, which shows the figure of merit and compressive strength of 1.6x10(-3)/K(25 degrees C), and 9.8 MPa, respectively. Thermoelectric properties showed no anisotropy of electr ical transport phenomena because the microstructure had no orientation of the grain growth, The improved compressive strength was presumably due to small grain sizes. The milling mechanism obeyed Kick's law.