ADHESION PROMOTION AT HIGH-TEMPERATURE FOR EPOXY-RESIN OR POLYIMIDE ONTO METAL BY A 2-COMPONENT COUPLING SYSTEM OF POLYBENZIMIDAZOLE AND 4-AMINOPHENYL DISULFIDE

Citation
G. Xue et al., ADHESION PROMOTION AT HIGH-TEMPERATURE FOR EPOXY-RESIN OR POLYIMIDE ONTO METAL BY A 2-COMPONENT COUPLING SYSTEM OF POLYBENZIMIDAZOLE AND 4-AMINOPHENYL DISULFIDE, Journal of applied polymer science, 58(12), 1995, pp. 2221-2227
Citations number
21
Categorie Soggetti
Polymer Sciences
ISSN journal
00218995
Volume
58
Issue
12
Year of publication
1995
Pages
2221 - 2227
Database
ISI
SICI code
0021-8995(1995)58:12<2221:APAHFE>2.0.ZU;2-Q
Abstract
A two-component coupling agent layer consisting of polybenzimidazole a nd 4-aminophenyl disulfide showed better anticorrosive performance and higher adhesive strength for copper and resins than did each single c omponent even at high temperature. (C) 1995 John Wiley & Sons, Inc.