Ar. Chelyadinskii et Hih. Taher, DIFFUSION OF ION-IMPLANTED PHOSPHORUS IN SILICON, Physica status solidi. a, Applied research, 142(2), 1994, pp. 331-338
Diffusion of ion-implanted phosphorus in silicon during rapid thermal
annealing (RTA) and thermal furnace annealing at various concentration
s of radiation defects is investigated using an electrical method. The
diffusion of phosphorus in layers previously doped with Ge is also st
udied. Part of the inserted phosphorus at thermal treatment is establi
shed to be captured by the surplus vacancies as the traps determining
the displacement of the phosphorus distribution towards the surface. T
he other part of the impurity in form of P atom-Si atom complexes acce
lerates the phosphorus diffusion. The temperature independence of the
effective coefficient of diffusion of implanted phosphorus in a wide t
emperature range of RTA is explained by the closeness of the activatio
n energy of diffusion of the complex PI and the activation energy of i
ts annealing.