MICROSTRUCTURE AND DIFFUSION IN NB NBSN2 METAL-BONDING STRUCTURE/

Authors
WERDER DJ CHEN CH CHEN HS BACON DD
Citation
Dj. Werder et al., MICROSTRUCTURE AND DIFFUSION IN NB NBSN2 METAL-BONDING STRUCTURE/, Journal of materials research, 10(12), 1995, pp. 2988-2991
Citations number
8
Categorie Soggetti
Material Science
Journal title
Journal of materials research → ACNP
ISSN journal
08842914
Volume
10
Issue
12
Year of publication
1995
Pages
2988 - 2991
Database
ISI
SICI code
0884-2914(1995)10:12<2988:MADINN>2.0.ZU;2-A
Abstract
This communication reports on the microstructure and interdiffusion ob served in a new NbSn2/Nb metallization structure on SiO2, previously r eported [H. S. Chen et al., Appl. Phys. Lett. 66, 2191 (1995)]. The as -deposited NbSn2 layer was found to be amorphous. After heating, the N bSn2 becomes polycrystalline and heavily diffused with Au from the Au- Sn solder. The Nb layer remains pure and intact after heating. The mic rostructure, compositions, and phases of the Au-Sn solder layer are al so presented.