CURING BEHAVIOR OF WOOD ADHESIVES UNDER HIGH-PRESSURE STEAM .1.
Citation
K. Umemura et al., CURING BEHAVIOR OF WOOD ADHESIVES UNDER HIGH-PRESSURE STEAM .1., Mokuzai Gakkaishi, 41(9), 1995, pp. 828-836
Categorie Soggetti
Materials Science, Paper & Wood
SICI code
0021-4795(1995)41:9<828:CBOWAU>2.0.ZU;2-I
Abstract
The curing behavior of aqueous phenol formaldehyde (PF) resol resin un
der steam-injection heating was investigated using several analytical
methods. The results were as follows: (1) The curing reaction of 2-hyd
roxybenzyl alcohol as a model compound, under steam-injection at 160 d
egrees C was followed by rapid formation and then breakdown of the eth
er group. (2) By steam-injection at the higher temperature of 160 degr
ees C, it was revealed that the PF resin immediately cured to some deg
ree in a few minutes; after that, it did not reach a full cure. The re
sin also accompanied the rapid disappearance of the ether structure. I
n the resin heated by steam-injection, free water hindered the curing
reaction, and by-products were contained. At the lower temperature of
120 degrees C, the curing reaction of the resin was somewhat delayed c
ompared to that heated under conventional hot-platen heating.