R. Dietsch et al., PULSED-LASER DEPOSITION (PLD) - AN ADVANCED STATE FOR TECHNICAL APPLICATIONS, Optical and quantum electronics, 27(12), 1995, pp. 1385-1396
The conventional thin-film deposition equipment of pulsed laser deposi
tion (PLD) has been modified for the preparation of individual thin so
lid films and nanometer-layer stacks of uniform thickness across 100-m
m substrates. The planar target configuration was replaced by a cylind
rical one and the target motion regime has been improved to provide pr
ecise spatial control of the plasma plume orientation. During thin-fil
m deposition, substrate translation is preferred instead of the usual
rotation technique. With this arrangement the emission characteristic
of the plasma source can be computer controlled and the desired coatin
g can be tailored via a stepper-motor-driven manipulator for the desir
ed layer thickness profile across an extended substrate. Thus, for exa
mple, a homogeneous film thickness is obtained even for lower target/s
ubstrate distances, and an appropriate deposition rate can be maintain
ed. In a second version, this cylinder geometry principle of plasma pl
ume control by target surface morphology is extended to a spatial solu
tion. The hemispherical target surface becomes the basic element for i
nside-wall coating of tubes or even of more complex hollow bodies. Fir
st applications of the equipment are explained and compared with typic
al results of the conventional technique.