A microactuator technology that combines magnetic thin films with poly
silicon flexural structures is described, Devices are constructed in a
batch-fabrication process that combines electroplating with conventio
nal lithography, materials, and equipment, A microactuator consisting
of a 400 x (47 - 40) x 7 mu m(3) rectangular plate of NiFe attached to
a 400 x (0.9 - 1.4) x 2.25 mu m(3) polysilicon cantilever beam has be
en displaced over 1.2 mm, rotated over 180 degrees, and actuated with
over 0.185 nNm of torque, The microactuator is capable of motion both
in and out of the wafer plane and has been operated in a conductive fl
uid environment. Theoretical expressions for the displacement and torq
ue are developed and compared to experimental results. [144]