DEMONSTRATION OF 3-DIMENSIONAL MICROSTRUCTURE SELF-ASSEMBLY

Citation
Pw. Green et al., DEMONSTRATION OF 3-DIMENSIONAL MICROSTRUCTURE SELF-ASSEMBLY, Journal of microelectromechanical systems, 4(4), 1995, pp. 170-176
Citations number
48
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
10577157
Volume
4
Issue
4
Year of publication
1995
Pages
170 - 176
Database
ISI
SICI code
1057-7157(1995)4:4<170:DO3MS>2.0.ZU;2-K
Abstract
Abstract-Self-assembly of three-dimensional microstructures using the surface tension force of molten solder to produce out-of-plane rotatio n is demonstrated. The generic nature of the technique is illustrated by reconfiguring structures formed in both Ni metal and single crystal Si, The structures do not have a hinge to constrain the rotation. Thi s considerably simplifies fabrication and eliminates problems associat ed with the compatibility of a suitable hinge material. Details of the fabrication processes are given and results are presented for rotated structures. [139]