THE MAGNETRON-ACTIVATED DEPOSITION PROCESS

Plasma-activated physical vapor deposition techniques result in layers with substantially improved properties. In particular in the manufact ure of compound layers through reactive deposition a plasma-activated regime cannot be dispensed with. However, as far as high rate large-ar ea coating is concerned, suitable plasma sources are not yet available . A new technique, i.e. the magnetron-activated deposition process whi ch uses the plasma of pulsed discharges of magnetron type to activate the reactive deposition, is presented. The discharges occur in an argo n-reactive gas mixture but may also take place directly in the metal v apor without argon. Bipolar pulsed magnetron electrodes further permit the deposition of electrically highly insulating compound layers. The first experiences gained with a roll coater for the production of alu mina layers are described.