Wm. Kim et al., EFFECT OF ION IRRADIATION ON INTERNAL-STRESS OF AMORPHIC CARBON-FILMSPRODUCED BY PULSED-LASER, Thin solid films, 270(1-2), 1995, pp. 237-242
Amorphic carbon films either 50 or 160 nm thick were deposited on Si(1
00) and glass substrates at room temperature in a high-vacuum environm
ent using a Q-switched Nd-YAG pulse laser focused on a graphite target
. These films were irradiated with Ti+ or C+ ions having kinetic energ
ies of 35 and 75 keV, and the changes in internal stresses of the film
s with varying ion influence were investigated by measuring substrate
bending using stylus profilometry. The ion energy and the film thickne
ss were chosen such that the ion penetration depth, R(p), corresponded
to either the film thickness or one half of the film thickness. The r
esults indicate that there is an optimum ion fluence leading to a stre
ss-free film for a given ion species and energy. Interpretation of the
resulting stress behavior from ion irradiation was made based on the
relaxation resulting from damage inside the film together with interfa
cial mixing. The scanning electron microscopy pictures and surface rou
ghness measurements showed a very smooth surface for both as-deposited
and ion-irradiated films. The ion-irradiated films had a Vickers hard
ness greater than 22 GPa, and were adherent to both Si and glass subst
rates. An investigation of the film characteristics using Raman scatte
ring and electron-energy loss spectra has revealed that high-energy io
n irradiation of an intermediate ion fluence can be utilized successfu
lly to deposit an adherent and hard carbon film with controlled intern
al stress without changing the film structure significantly.