I. Vitina et al., THE CHANGES OF STRUCTURE UPON THERMAL-TREATMENT OF GOLD COATINGS ELECTRODEPOSITED ON VACUUM-SPUTTERED TI AND ELECTRODEPOSITED NI-B OR NI-FELAYERS, Thin solid films, 270(1-2), 1995, pp. 380-386
The changes in structure and chemical composition of gold coatings aft
er thermal treatment in dependence on the composition of metallic laye
rs has been studied by transmission electron microscopy, scanning elec
tron microscopy and X-ray diffraction (XRD). An electrodeposited gold
coating on Ti as well as on Fe-Ni/Cu and Ni-B/Cu systems had no observ
able changes in phase composition and structure after thermal treatmen
t of 200 h at 150-200 degrees C. Spontaneous growth of gold crystal wh
iskers were observed on the gold coating on a Ti substratum (50-100 h,
350 degrees C). There were changed friable structures in some places.
XRD data testify a presence of Au2Ti and AuTi3. A changed structure c
ontaining big grains developed in some places on the gold coating of t
he system Au/Fe-Ni/Cu after thermal treatment (50 h, 350 degrees C). N
ickel diffusion and the presence of intermetallic AuCn in the gold coa
ting was also observed, The gold coating of the system Au/Ni-B/Cu rema
ins stable with respect tb structure and chemical purity. The electrod
eposited Ni-B layer (B, 4-8 wt.%; C, 3-7 and 10(-2) wt.% in dependence
of the technique of electrodeposition) is amorphous. The gold coating
on a Ni-B substratum had no observable changes in structure after a t
hermal treatment of 200 h, 350 degrees C.