FABRICATION OF 200 NM FIELD-EFFECT TRANSISTOR BY X-RAY-LITHOGRAPHY WITH A LASER-PLASMA X-RAY SOURCE

Citation
Cm. Reeves et al., FABRICATION OF 200 NM FIELD-EFFECT TRANSISTOR BY X-RAY-LITHOGRAPHY WITH A LASER-PLASMA X-RAY SOURCE, Electronics Letters, 31(25), 1995, pp. 2218-2219
Citations number
2
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00135194
Volume
31
Issue
25
Year of publication
1995
Pages
2218 - 2219
Database
ISI
SICI code
0013-5194(1995)31:25<2218:FO2NFT>2.0.ZU;2-I
Abstract
The critical dimensions required for 1Gbit semiconductor technology wi ll be beyond the capabilities of optical lithography. The laser-genera ted plasma X-ray source provides an alternative to synchrotron radiati on for lithography, providing a quasi point source of radiation at sim ilar to 1nm wavelength. The 180nm lithography required for 1Gbit has b een demonstrated by exposure of a novel commercial resist using a labo ratory prototype plasma X-ray source. A MOSFET with 200nm gate length has been produced using the new technology in mix-and-match with conve ntional methods. The device shows good electrical characteristics, dem onstrating the promise of this approach.