SOFTENING OF THE ELASTIC-MODULUS IN SUBMICROCRYSTALLINE COPPER

Authors
LEBEDEV AB BURENKOV YA ROMANOV AE KOPYLOV VI FILONENKO VP GRYAZNOV VG
Citation
Ab. Lebedev et al., SOFTENING OF THE ELASTIC-MODULUS IN SUBMICROCRYSTALLINE COPPER, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 203(1-2), 1995, pp. 165-170
Citations number
32
Categorie Soggetti
Material Science
Journal title
Materials science & engineering. A, Structural materials: properties, microstructure and processing → ACNP
ISSN journal
09215093
Volume
203
Issue
1-2
Year of publication
1995
Pages
165 - 170
Database
ISI
SICI code
0921-5093(1995)203:1-2<165:SOTEIS>2.0.ZU;2-F
Abstract
Young's modulus of copper polycrystals with an ultrafine-grained struc ture synthesized by two independent methods (compacting and heavy plas tic deformation) has been measured within a temperature range from 20 to 200-300 degrees C. It has been concluded that there is a component of the Young's modulus softening which is peculiar to metals with nano - and submicrocrystalline structures, irrespective of the presence of porosity.