U. Klement et al., THERMAL-STABILITY OF NANOCRYSTALLINE NI, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 203(1-2), 1995, pp. 177-186
Thermal stability of electroplated nanocrystalline Ni of 10 and 20 nm
grain size was investigated by differential scanning calorimetry (DSC)
. The temperature dependence and heat release Delta H during grain gro
wth have been determined by linear anisothermal measurements (linear h
eating at 10 K min(-1)). The corresponding change in microstructure ha
s been monitored in the temperature range between 373 K and 693 K usin
g transmission electron microscopy (TEM). The TEM and DSC studies iden
tified three exothermic reactions: ''nucleation'' and abnormal grain g
rowth (353-562 K), normal grain growth (562-593 K) and growth towards
equilibrium (643-773 K). The grain growth behaviour, and the similar h
eat releases Delta H = 18 J g(-1) and 16 J g(-1) measured for the 10 n
m and 20 nm Ni nanocrystals respectively in the DSC experiments may be
related to the observed sulphur segregation at grain boundaries and t
riple junctions.