LOW-VOLTAGE CIRCUIT-DESIGN TECHNIQUES FOR BATTERY-OPERATED AND OR GIGA-SCALE DRAMS/

This paper describes a charge-transferred well (CTW) sensing method fo r high-speed array circuit operation and a level-controllable local po wer line (LCL) structure for high-speed/low-power operation of periphe ral logic circuits, aimed at low voltage operating and/or giga-scale D RAM's, The CTW method achieves 19% faster sensing and the LCL structur e realizes 42% faster peripheral logic operation than the conventional scheme, at 1.2 V in 16 Mb-level devices. The LCL structure realizes a subthreshold leakage current reduction of three or four orders of mag nitude in sleep mode, compared with a conventional hierarchical power line structure. A negative-voltage word line technique that overcomes the refresh degradation resulting from reduced storage charge (Q(s)) a t low voltage operation for improved reliability is also discussed. An experimental 1.2 V 16 Mb DRAM with a RAS access time of 49 ns has bee n successfully developed using these technologies and a 0.4-mu m CMOS process. The chip size is 7.9 x 16.7 mm(2) and cell size is 1.35 x 2.8 mu m(2).