COLLECTIVE FABRICATION OF MICROSYSTEMS COMPATIBLE WITH CMOS THROUGH THE CMP SERVICE

One of the main obstacles to starting microsystems is the fact that pa rticular and hence costly processes are needed. In order to reach affo rdable prices and a high flexibility, microsystems should whenever pos sible be conceived such that they can be realized on existing producti on lines for microelectronics, with additional post-processing for mic ro-system-specific 2D and 3D structures, e.g. through Multi-Project-Wa fer services as proposed by the CMP service. Furthermore, this approac h allows to integrate the microelectronics, needed in most microsystem s, on the same chip. This paper describes the main micromachining meth ods, including design theory, implementation and recommendations. It p resents the results obtained of microelectronics compatible fabricatio n methods (CMOS bulk and surface micromachining) and microelectromecha nical systems that have been fabricated using these technologies. It a lso details the CAD tools support.