Microexplosions of suspended boron/JP-10 and boron/carbon/JP-10 slurry
droplets were studied for various solids loadings (Y(s) = 0.2-0.5) in
the postflame region of a flat-flame burner. While the small-particle
amorphous boron slurry droplets of a low solids loading (Y(s) = 0.2)
shrank considerably before microexplosion, the droplets of high loadin
gs (Y(s) = 0.3-0.5) held a nearly constant diameter before considerabl
e swelling and drastic disruption occurred. For a fixed surfactant con
centration of 0.05, the microexplosions were observed to be most viole
nt at Y(s) congruent-to 0.45. The transient internal temperature distr
ibutions of small-particle amorphous boron slurry droplets (Y(s) = 0.4
) were measured up to microexplosion with fine thermocouples at 1000 K
. Measurements indicated that temperatures at the outer region of the
droplets rose continuously beyond the boiling point of JP-10, resultin
g from evaporation suppression by the surface shell textures. The key
event appeared to be the evaporation-suppressed heating process, simil
ar to the microexplosion mechanism proposed by Wong and Lin for Al/C/J
P-10 slurries. The semiempirical microexplosion model of Wong and Lin
was applied to an amorphous boron slurry of Y(s) = 0.4, with the empir
ical factors carefully determined at initial diameters of 1330 +/- 30
mum, and an ambient temperature of 1000 K. The calculations agreed sat
isfactorily with the experimental data at various droplet diameters an
d ambient temperatures. The effects of carbon black on microexplosion
were also examined. For small-particle amorphous B/C/JP-10 slurries of
Y(s) = 0.3, a proportion of 8-12 wt.% carbon in the solids resulted i
n stronger microexplosions. At larger Y(s), the advantageous effects d
iminished and the addition of carbon black became unfavorable when Y(s
) greater-than-or-equal-to 0.45. For large-particle crystalline B/C/JP
-10 slurries (mean boron particle diameter of about 20 mum), the addit
ion of an appropriate amount of carbon black always appeared beneficia
l.