RESIDUAL-STRESS, STRAIN AND FAULTS IN NANOCRYSTALLINE PALLADIUM AND COPPER

Citation
Pg. Sanders et al., RESIDUAL-STRESS, STRAIN AND FAULTS IN NANOCRYSTALLINE PALLADIUM AND COPPER, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 204(1-2), 1995, pp. 7-11
Citations number
16
Categorie Soggetti
Material Science
ISSN journal
09215093
Volume
204
Issue
1-2
Year of publication
1995
Pages
7 - 11
Database
ISI
SICI code
0921-5093(1995)204:1-2<7:RSAFIN>2.0.ZU;2-E
Abstract
Nanocrystalline Pd and Cu, prepared by inert-gas condensation and warm compaction, were studied using X-ray diffraction techniques. A sample of Cu with submicrometer grain size produced by severe plastic deform ation was also examined. The Warren-Averbach technique was used to sep arate the line broadening due to grain size, t.m.s. strain and faults. Peak shifts and asymmetry were used to determine the long-range surfa ce stresses, stacking-fault probability and twin probability. Young's modulus for a Pd sample was determined by an ultrasonic technique and compared with the coarse-grained, fully dense value.