Ht. Ren et al., AC SUSCEPTIBILITY IN Y123 AND AG-DOPED Y123 COMPOUNDS PREPARED BY THEMELT-TEXTURED-GROWTH METHOD, Physica. C, Superconductivity, 218(1-2), 1993, pp. 87-93
Bulk Y123 and Y123 + 4.5wt.% Ag samples with high J(c) were prepared b
y a melt-textured-growth process. AC susceptibility measurements have
been carried out and the temperature dependence of chi'' in these mate
rials is presented. The results show that the ''peak temperature'' T(p
) of chi''(T) shifts to lower temperatures as the AC field amplitude (
h(AC)) is increased. The slopes of the T(p)-h(AC)2/3 lines for h(AC) p
arallel to the c-axis are larger than those with h(AC) perpendicular t
o the c-axis. We believe that the higher slope corresponds to a strong
intergranular coupling. The presence of silver has no effect on the c
oupling in the a-b plane of the material, but is found to enhance the
coupling parallel to the c-axis direction.