Improvements in electron-beam writing techniques have allowed us to co
mpensate for electron-beam system drift, making feasible tile exposure
of 800 x 800 mu m gratings with period as small as 0.14 mu m. Placeme
nt errors due to drift, calibration errors, and nonplanar substrates a
re measured with verniers. Gratings patterned with interferometric pho
tolithography provide an absolute reference for a measure of stage non
linearity (runout.) Simulation of fracture formation in silicon nitrid
e films has given us a tool for the prediction of structures that will
fail during fabrication, and a way of evaluating stress relief patter
ns in arbitrary structures. We have used two sets of simple patterns t
o identify tile critical stress intensity factors in thin, free-standi
ng films of nonstoichiometric silicon nitride.