Reactive ion etching a characteristics of epitaxial Si1-xGex layers in
SiCl4/Cl-2/N-2 plasma are investigated by different diagnostic techni
ques, such as Auger electron spectroscopy, X-ray photoelectron spectro
scopy, and atomic force microscopy. Surface morphology and stoichiomet
ry are influenced by the dry etching process. A slight Ge enrichment a
t the etched SiGe films is explained by the different volatility of th
e corresponding chlorides. Moreover, a procedure which allows an exact
ly determined etch stop in a thin buried SiGe alloy - as a necessary r
equirement for the following surface analysis - is introduced.