EFFECT OF TEMPERATURE ON THE INTERACTION OF SILICON WITH NONIONIC SURFACTANTS IN ALKALINE-SOLUTIONS

The interaction of silicon wafers with alkaline solutions of octylphen ol polyethylene oxide nonionic surfactants of different ethylene oxide chain length has been characterized at 25, 50, and 75 degrees C. Wett ability of silicon wafers was improved significantly at higher tempera tures. Surfactants with long ethylene oxide chains exhibited less adso rption than surfactants with short ethylene oxide chains, and increase in solution temperature resulted in increased adsorption. Generally, the addition of surfactants to alkaline solution decreased the surface roughness of silicon; however, the degree of reduction of surface rou ghness was influenced by the length of ethylene oxide chain and condit ioning temperature.