S. Takeishi et al., STABILIZING DIELECTRIC-CONSTANTS OF FLUORINE-DOPED SIO2-FILMS BY N2O-PLASMA ANNEALING, Journal of the Electrochemical Society, 143(1), 1996, pp. 381-385
Fluorine-doped SiO2(FSG) has a low dielectric constant just after depo
sition. However, the dielectric constant of FSG gradually increases wi
th time when left in air. We have developed a way to stabilize dielect
ric constants of FSG left in the air by plasma annealing. We have foun
d that N2O-plasma annealing is quite effective for blocking moisture.
The dielectric constants of FSG treated by the N2O-plasma annealing ra
rely change.