LATEST DEVELOPMENTS FOR MICROSTRUCTURAL AND CHEMICAL CHARACTERIZATIONOF DIFFUSION BONDING IN SUPERPLASTIC-8090 AL-LI ALLOYS

Citation
A. Urena et al., LATEST DEVELOPMENTS FOR MICROSTRUCTURAL AND CHEMICAL CHARACTERIZATIONOF DIFFUSION BONDING IN SUPERPLASTIC-8090 AL-LI ALLOYS, Journal of materials research, 11(1), 1996, pp. 63-71
Citations number
24
Categorie Soggetti
Material Science
ISSN journal
08842914
Volume
11
Issue
1
Year of publication
1996
Pages
63 - 71
Database
ISI
SICI code
0884-2914(1996)11:1<63:LDFMAC>2.0.ZU;2-L
Abstract
This paper describes a new application of two complementary surface ch aracterization techniques to study solid-state bonding in an Al-Li all oy. Through the two mentioned techniques, Atomic Force Microscopy (AFM ) and Secondary Ion Mass Spectrometry (SIMS), important findings about what takes place in the bond interface have been determined. These fi ndings enclose both the formation of discontinuous mixed oxides and th e evolution of Li through the bond line and into the adjacent diffusio n affected zones. Homogenization of Li and Cu alloy elements has been detected even in those cases where a metallic interlayer was used to f avor the union.