FATIGUE-CRACK PROPAGATION LIFE ANALYSIS OF SOLDER JOINTS UNDER THERMAL CYCLIC LOADING

Fatigue crack propagation life analysis of solder joints under thermal cyclic loadings was investigated by the strain energy release rate me thod using finite element analysis. A relationship between the crack-g rowth rate and the strain energy release rate was derived. Finite elem ent simulations were carried out to investigate the effect of crack gr owth along the interface of solder and lead in a solder joint assembly . The crack propagation life of the solder joint with an interface cra ck was predicted from the derived relationship between crack growth ra te and values of the strain energy release rate. It was found that cra ck propagation life is much higher than the crack initiation life.