Rutherford backscattering spectroscopy (RBS) and X-ray photoelectron s
pectroscopy (XPS) have been used to characterize GexNy films grown on
Si substrates. The films were deposited in a plasma chemical reactor b
y a radio frequency (r.f.)-generated supersonic plasma jet. The Ge noz
zle of the r.f. electrode was reactively sputtered in the plasma jet g
enerated in the nitrogen and the germanium nitride films were created
in the reactor. The RBS method showed that the ratio Ge:N in the layer
was close to the expected stoichiometric ratio 3:4 (for example, 0.73
, which is within experimental error) when traces of oxygen were suppr
essed. The chemical bonding state of Ge-N, as found by XPS analysis, s
howed that, close to the thin film surface, the Ge:N ratio was also ne
ar 3:4. The impurities present, although in small amount, were prefere
ntially bonded into the film.