To reduce fabrication costs of fibre-optic terminal modules for intera
ctive services, an InGaAsP/InP chip fabrication process has been devel
oped for monolithic integration of a strained-layer multiple quantum w
ell laser, a monitor diode and a photoreceiver with a 1300/1530nm filt
er. Reception responsivity and output power of the chips are 0.1 AW(-1
) at 1300nm wavelength and 4.5mW at 1530nm wavelength, respectively. A
t present, complete modules with fibre pigtail exhibit 0.7mW launch po
wer, but 1.4mW is expected with the latest chips.