Kf. Lin et Jc. Chen, CURING, COMPATIBILITY, AND FRACTURE-TOUGHNESS FOR BLENDS OF BISMALEIMIDE AND A TETRAFUNCTIONAL EPOXY-RESIN, Polymer engineering and science, 36(2), 1996, pp. 211-217
The curing, compatibility, and fracture toughness of blends of 4,4'-bi
smaleimidodiphenylmethane (BDM)/tetraglycidyl diamino-diphenyl methane
(TGDDM) were investigated. Diamino-diphenyl sulfone (DDS) was used as
a curing agent. BDM alone could be both homopolymerized (at a lower t
emperature) and could also undergo Michael addition reactions with the
primary amine of DDS. The secondary amine of DDS did not react with B
DM. However, the network produced by homopolymerization was not miscib
le with that produced by the latter reactions. Curing of TGDDM with DD
S took place almost at the same temperature as that of the homopolymer
ization of BDM, but well below the temperature of the Michael addition
reaction. When a BDM/TGDDM mixture was cured with DDS In the stoichio
metric ratio, the miscibility of the cured system increased with the a
mount of TGDDM. This was attributed to the fact that the network produ
ced by Michael addition reactions was diminished. When DDS reacted ent
irely with TGDDM, the BDM/TGDDM/DDS cure yielded only a TGDDM/DDS netw
ork and a BDM homopolymerized network, which were not only miscible, b
ut are also interpenetrating. The superior interpenetrated network, as
indicated by the highest fracture toughness, was found at BDM/TGDDM =
40/60 weight ratio in the BDM/TGDDM/DDS curing systems.