LARCTM-IAX2 (Langley Research Center-Improved Adhesive eXperimental re
sin 2) aromatic polyimide, based on oxydiphthalic anhydride (ODPA), be
nzophenone tetracarboxylic acid dianhydride (BTDA), and 3,4-oxydianili
ne (3,4'-ODA), was evaluated as a matrix for high performance composit
es. This polymer is a modified version of the baseline LARCTM-IA polyi
mide made from ODPA and 3,4'-ODA. Two poly (amide acid) solutions end-
capped with phthalic anhydride were synthesized in N-methypyrrolidone
and N,N-dimethylacetamide (DMAc) with ODPA to BTDA ratios of 4:1 and 3
:1, respectively. Fully imidized films exhibited improved solvent resi
stance in acetone, methylethylketone, toluene, DMAc, and chloroform co
mpared to the baseline LARCTM-IA film. Unidirectional prepregs were fa
bricated from both solutions using the Langley multi-purpose prepreg m
achine. A separate molding cycle (350 degrees C/250psi) was developed
for each prepreg based upon solvent-volatile depletion characteristics
. These cycles consistently yielded void-free consolidated laminates b
ut required more severe processing conditions than those for the basel
ine material. Short beam shear strength and longitudinal flexural prop
erties were measured at room temperature. 93 degrees, 150 degrees, and
177 degrees C. Notably, the flexural moduli were about 5% higher than
those reported for the baseline composite. In addition, engineering p
roperties such as fracture toughness, unnotched tensile strength, notc
hed and unnotched compressive strengths and moduli, compression streng
th after impact and open hole compression strength were also measured.
The enhanced solvent resistance, more difficult processability, and h
igher flexural moduli compared to those for the baseline composites we
re attributed to an increase in polymer backbone stiffness due to the
presence of BTDA. No differences in the physical and mechanical proper
ties were observed between composites made in NMP and DMAc. The result
s have helped define a chemical approach for improving solvent resista
nce in thermoplastic polyimide materials.