PD-NI-PLATED LIDS FOR FRAME-LID ASSEMBLIES

A GFPdNi finish was tested for Frame-Lid Assemblies (FLA) utilized in sealing integrated circuit (IC) packages. Plating conditions were adju sted to enhance corrosion resistance, with concurrent control over hyd rogen content and thickness distribution of the deposit. GFPdNi-plated lids exhibit excellent corrosion resistance, the advantage being most noticeable when compared with standard gold-plated lids after heat tr eatment, simulating the sealing process. This is a result of the known property of a Pd-Ni layer as a good interdiffusion barrier. The new p lating process has proven to satisfy SPC requirements, and the reliabi lity of lidded packages was sufficient to pass field evaluation.