RAPID THERMAL-PROCESSING FOR ULSI APPLICATIONS - AN OVERVIEW

Authors
REID KG SITARAM AR
Citation
Kg. Reid et Ar. Sitaram, RAPID THERMAL-PROCESSING FOR ULSI APPLICATIONS - AN OVERVIEW, Solid state technology, 39(2), 1996, pp. 63
Citations number
19
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
Solid state technology → ACNP
ISSN journal
0038111X
Volume
39
Issue
2
Year of publication
1996
Database
ISI
SICI code
0038-111X(1996)39:2<63:RTFUA->2.0.ZU;2-L
Abstract
Rapid thermal processing (RTP) technology has made significant advance s in recent years. Dynamic feedback, multizone control, and axially sy mmetric chamber design have helped to improve manufacturability and pr ocess control. This article will discuss historical and state-of-the-a rt RTP technology. Throughput and cycle time for conventional CMOS pro cesses in RTP and batch furnaces will be compared. Cost of ownership ( COO) for thermal processors will be discussed, highlighting the import ance of throughput.