H. Kuhne et al., ON THE MECHANISM OF BORON INCORPORATION DURING SILICON EPITAXY BY MEANS OF CHEMICAL-VAPOR-DEPOSITION, Journal of the Electrochemical Society, 143(2), 1996, pp. 634-639
A careful re-examination of experimental results on in situ boron-dopi
ng during silicon epitaxy which have been previously published(16) per
mits us to discuss how boron adsorption rate, desorption, and incorpor
ation rate are dependent on silicon growth rate. It is shown for the f
irst time that boron incorporation covers the whole range from equilib
rium-limited to kinetically controlled incorporation when certain depo
sition conditions are met. In the transition region boron incorporatio
n is affected by the reduction of boron adsorption not only due to the
consumption of adsorbed boron species by the doping process but also
by the increasing hindrance of boron adsorption due to the increase in
the film growth rate. At other deposition conditions the known adsorp
tion-desorption model of silicon doping describes boron incorporation
completely.