ON THE MECHANISM OF BORON INCORPORATION DURING SILICON EPITAXY BY MEANS OF CHEMICAL-VAPOR-DEPOSITION

Citation
H. Kuhne et al., ON THE MECHANISM OF BORON INCORPORATION DURING SILICON EPITAXY BY MEANS OF CHEMICAL-VAPOR-DEPOSITION, Journal of the Electrochemical Society, 143(2), 1996, pp. 634-639
Citations number
18
Categorie Soggetti
Electrochemistry
ISSN journal
00134651
Volume
143
Issue
2
Year of publication
1996
Pages
634 - 639
Database
ISI
SICI code
0013-4651(1996)143:2<634:OTMOBI>2.0.ZU;2-C
Abstract
A careful re-examination of experimental results on in situ boron-dopi ng during silicon epitaxy which have been previously published(16) per mits us to discuss how boron adsorption rate, desorption, and incorpor ation rate are dependent on silicon growth rate. It is shown for the f irst time that boron incorporation covers the whole range from equilib rium-limited to kinetically controlled incorporation when certain depo sition conditions are met. In the transition region boron incorporatio n is affected by the reduction of boron adsorption not only due to the consumption of adsorbed boron species by the doping process but also by the increasing hindrance of boron adsorption due to the increase in the film growth rate. At other deposition conditions the known adsorp tion-desorption model of silicon doping describes boron incorporation completely.