C. Huang et al., A SIMULTANEOUS SWITCHING NOISE DESIGN ALGORITHM FOR LEADFRAME PACKAGES WITH OR WITHOUT GROUND PLANE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 15-22
This paper provides design techniques for leadframe packages with or w
ithout a ground plane, which enable an accurate estimate of the maximu
m simultaneous switching noise (SSN) and the required numbers of power
and/or ground pins for prespecified SSN limits early in the design ph
ase, Two heuristic design approaches, namely equal-angle and quarter-p
lane, are proposed as initial design choices for the leadframe design
to meet prespecified SSN constraint, Effects of the signal conductors
in reducing the effective inductance of a leadframe package are quanti
fied. Closed-form equations and SPICE simulation are used to calculate
the simultaneous switching noise, A design example for a 28 x 28 mn p
lastic quad flat package (PQFP) is given to provide guidelines for SSN
-constrained design, The design algorithm is integrated into a CAD too
l, UASSNS3.0, which is capable of initial SSN design of leadframe pack
ages.