DEVELOPMENT OF ULTRA-COMPACT PLASTIC-PACKAGED HIGH-ISOLATION GAAS SPDT SWITCH

A high-isolation switch IC with 31 dB isolation and 0.88 dB insertion loss at 1.65 GHz, sealed in a six-pin ultra-compact plastic package wi th approximately 1/4 of the conventional area, was developed for the f irst time. Analysis using electromagnetic-held simulation of the isola tion characteristics between lead pins of the ultra-compact package an d a new design method (which takes into account deterioration of the i solation characteristics due to the plastic molding) were used for thi s IC. Layout design using electromagnetic-held simulation also attempt ed to minimize chip size.