2-DIMENSIONAL PATTERNS OF MAGNETIC PARTICLES AT AIR-WATER OR GLASS-WATER INTERFACES INDUCED BY AN EXTERNAL MAGNETIC-FIELD - THEORY AND SIMULATION OF THE FORMATION PROCESS
T. Takahashi et al., 2-DIMENSIONAL PATTERNS OF MAGNETIC PARTICLES AT AIR-WATER OR GLASS-WATER INTERFACES INDUCED BY AN EXTERNAL MAGNETIC-FIELD - THEORY AND SIMULATION OF THE FORMATION PROCESS, Journal of physical chemistry, 100(8), 1996, pp. 3157-3162
We describe theoretically the formation process of two-dimensional pat
terns of magnetic particles at an interface under the action of an ext
ernal magnetic field. First, we developed a theoretical model for the
forces acting on the particles, which are the magnetic attraction towa
rd the axis of symmetry, magnetic repulsion due to the induced dipoles
, electrostatic repulsion due to the surface net charge and electric d
ipoles of the particles, and lateral capillary forces in the case of a
liquid interface. Then, we developed a Brownian dynamics algorithm an
d simulated the pattern formation. Our simulations reproduced the hexa
gonally aligned two-dimensional patterns, which were experimentally ob
served and reported in the complementary experimental work, that is, t
hey reproduced the distance between the particles and the time of patt
ern formation. Irregular patterns such as square and pentagonal ones t
hat were experimentally observed were also simulated, We calculated th
at when the distance between particles is larger than 20 mu m (i.e., i
n case or a weak magnetic field), the magnetic force is sufficient to
explain the pattern formation. But, when the distance is smaller than
20 mu m, the electrostatic repulsive force may play an essential role
in determining the interparticle distance. Our calculations showed tha
t the lateral capillary forces and the electrostatic dipolar repulsive
forces were negligible for the pattern formation process. Finally, ou
r method for simulating the pattern formation may be applied for under
standing these processes and predicting the patterns that might be for
med at liquid or solid interfaces.