R. Tonini et al., SILICON INTERSTITIALS GENERATION DURING THE EXPOSURE OF SILICON TO HYDROGEN PLASMA, Materials science & engineering. B, Solid-state materials for advanced technology, 36(1-3), 1996, pp. 158-161
Interstitials in silicon can be produced by hydrogen ions through chem
ical action and physical impact. To establish the relative importance
of the two processes, wafers of single crystal silicon kept at a tempe
rature of 250 degrees C were exposed to a hydrogen plasma, with and wi
thout an accelerating voltage (500 V). As gettering centers interstiti
al-type dislocation loops were made, before H exposure, by implanting
1.9 x 10(15) at. cm(-2) 110 keV P atoms and annealing at 1000 degrees
C for 30 s. The analysis was performed using MeV ion channeling, elast
ic recoil detection analysis and cross-section transmission electron m
icroscopy. The results suggest that H is captured by the defects: in t
he case of unbiased plasma, H goes in the region of the extrinsic defe
cts, while in the case of biased plasma, H is trapped near the surface
where the defects are produced by the energetic H ions themselves. In
both cases the data are consistent with the formation of hydrogen nan
oblisters with the subsequent breaking of silicon bonds and injection
of silicon interstitials. The migration of interstitials occurs at a t
emperature as low as 250 degrees C.