ADHESION BETWEEN NI FE LEAD FRAME AND EPOXY MOLDING COMPOUNDS IN IC PACKAGES/

Authors
ASAI SI ANDO T TOBITA M
Citation
Si. Asai et al., ADHESION BETWEEN NI FE LEAD FRAME AND EPOXY MOLDING COMPOUNDS IN IC PACKAGES/, Journal of adhesion science and technology, 10(1), 1996, pp. 1-15
Citations number
22
Categorie Soggetti
Engineering, Chemical","Material Science",Mechanics
Journal title
Journal of adhesion science and technology → ACNP
ISSN journal
01694243
Volume
10
Issue
1
Year of publication
1996
Pages
1 - 15
Database
ISI
SICI code
0169-4243(1996)10:1<1:ABNFLF>2.0.ZU;2-M
Abstract
Improvement in the adhesion between an Alloy 42 (Ni/Fe alloy) lead fra me and epoxy molding compounds for IC packages was studied by (i) addi ng modifiers to the epoxy molding compounds; (ii) using various phenol resins as curing agents; and (iii) changing the Alloy 42 die pad surf ace to Al, SiO, SiO2 or Si3N4. Good improvement was obtained in all th ree cases. When the lead frame surface was changed to Al, SiO, SiO2 or Si3N4, almost complete adhesion was observed, even after moisture-abs orbed IC packages were dipped in the solder.