In this work, we demonstrate record low dark current operation of InGa
As (1.55 mu m) p-i-n photodetectors on both silicon and gallium arseni
de substrates using a wafer bonding technique. The photodetectors were
made by first bonding the p-i-n epitaxial layers to the Si and GaAs s
ubstrate followed by chemical removal of the host (InP) substrate from
the p-i-n structure. The photodetector was then fabricated atop the n
ewly exposed p-i-n epilayers. Dark currents of as low as 57 pA on a Ga
As substrate and 0.29 nA on a Si substrate were measured under 5 V rev
erse bias. The responsivity at 1.55 mu m wavelength was measured to be
1 A/W, corresponding to an external quantum efficiency of 80%. The se
ries resistance measured across the bonded interface gave 17 Ohm on Ga
As and 350 Ohm on Si, respectively. (C) 1995 American Institute of Phy
sics.