The adsorption of Cl-2 on Cu{lll} at 300 K has been studied using shad
ow-cone-enhanced secondary ion mass spectrometry (SIMS). The system ha
s been investigated for chlorine coverages ranging from 0.08 to 0.33 m
onolayer (ML), including the Cu{lll}-(root 3 x root 3)R30 degrees-Cl s
urface. The secondary Cu+ ion intensity has been measured as a functio
n of the incidence angle of the primary ion beam. The enhanced intensi
ty features in the spectra are compared with results from a two-body i
nteraction calculation that uses the Moliere approximation to the Thom
as-Fermi potential. A chlorine-copper interlayer spacing of 1.87 +/- 0
.04 Angstrom is measured between the coverages of 0.17 and 0.33 ML. Th
is value corresponds to a chlorine-copper bond length of 2.38 +/- 0.04
A, At 0.08 ML, the chlorine-copper bond length is expanded to 2.48 +/
- 0.04 Angstrom. These results suggest that the chlorine-copper bond i
s more ionic in the low coverage limit.