RATE MONITOR FOR CHEMICAL ETCHING OF COPPER-FILMS

Citation
Hh. Law et al., RATE MONITOR FOR CHEMICAL ETCHING OF COPPER-FILMS, Plating and surface finishing, 83(3), 1996, pp. 72-75
Citations number
5
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Materials Science, Coatings & Films
ISSN journal
03603164
Volume
83
Issue
3
Year of publication
1996
Pages
72 - 75
Database
ISI
SICI code
0360-3164(1996)83:3<72:RMFCEO>2.0.ZU;2-R
Abstract
Etching copper layers to yield reproducible fine line patterns is an e ssential operation in conventional hybrid circuit or printed circuit b oard fabrication. The etch rate is commonly monitored by the amount of copper etched from a copper layer with a known thickness, and it requ ires many thickness measurements to obtain the desired accuracy, A nov el simple-to-use visual rate monitor has been developed for the copper etching operation, and it can be fabricated from inexpensive commerci ally available equipment in a straightforward manner, The etch rate me asurement time is reduced to the residence time of the monitor in the etcher.