MICROSTRUCTURE AND THERMAL CONDUCTION PROPERTIES OF AL2O3-AG COMPOSITES

Authors
Citation
Dm. Liu et Wh. Tuan, MICROSTRUCTURE AND THERMAL CONDUCTION PROPERTIES OF AL2O3-AG COMPOSITES, Acta materialia, 44(2), 1996, pp. 813-818
Citations number
30
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
Journal title
ISSN journal
13596454
Volume
44
Issue
2
Year of publication
1996
Pages
813 - 818
Database
ISI
SICI code
1359-6454(1996)44:2<813:MATCPO>2.0.ZU;2-E
Abstract
Microstructure and thermal conduction properties involving thermal dif fusivity and conductivity of composite, Al2O3-Ag, were investigated. T he Ag particles observed in the composites were spread sporadically th roughout the composite with inclusion size increasing with Ag content, rather than forming a network of thin film foil. Thermal conductivity of the composite increased with Ag content and followed composite the ory prediction with a negligible influence of interfacial contact resi stance. The temperature dependence of the thermal conductivity became less pronounced with increasing Ag content reflecting the nature of el ectron contribution in Ag rather than the typical phonon contribution in polycrystalline Al2O3. The lower composite conductivity at higher A g contents as compared to theoretical predictions is due primarily to the residual pore phase, associated with the cavity formation for the composite containing 10 vol.% Ag.