Ta. Halgren, MERCK MOLECULAR-FORCE FIELD .5. EXTENSION OF MMFF94 USING EXPERIMENTAL-DATA, ADDITIONAL COMPUTATIONAL DATA, AND EMPIRICAL RULES, Journal of computational chemistry, 17(5-6), 1996, pp. 616-641
This article describes the extension of the Merck Molecular Force Fiel
d (MMFF94) to a much broader range of organic systems. It also describ
es a preliminary parameterization of MMFF94 for the hydronium and hydr
oxide ions and for various halide, alkalai, and alkalai earth ions as
well as for such ''protein'' metals as Zn2+, Ca2+, Cu2+, Cu+ Fe2+, and
Fe3+. The extension employed computational data on charge distributio
ns, molecular geometries, and conformational energies for a series of
oxysulfur (particularly sulfonamide) and oxyphosphorous compounds and
for a diverse set of small molecules and ions not covered in the core
parameterization. It also employed experimental data for approximately
2800 good-quality structures extracted from the Cambridge Structural
Database (CSD). Some of the additional computational data were used to
extend the explicit parameterization of electrostatic interactions an
d to more widely define a useful additive approximation for the ''bond
polarity'' parameters (bond charge increments) used in MMFF94. Both t
he experimental and computational data served to define reference bond
lengths and angles that the extended force field uses in conjunction
with force constants obtained from carefully calibrated empirical rule
s. The extended torsion parameters consist partly of explicit paramete
rs derived to reproduce MP2/6-31G conformational energies and partly
of ''default parameters'' provided by empirical rules patterned after
those used in DREIDING and UFF but calibrated, where possible, against
computationally derived MMFF94 torsion parameters. Comparisons to exp
erimental data show that MMFF94 reproduces crystallographic bond lengt
hs and boned angles with relatively modest root mean square (rms) devi
ations of similar to 0.02 Angstrom and 2 degrees, respectively. (C) 19
96 by John Wiley & Sons, Inc.