A STUDY OF ANODIC PROCESS OF COPPER IN NA OH SOLUTION

The anodic process of copper in concentrated NaOH solutions was studie d by potential slow scan and galvanostatic methods, and angle dependen t X-ray photoelectron spectroscopy analysis. The result shows tile sec ond passive film on copper surface is made up of an inner Cu2O layer f ollowed by a CuO-Cu(OH)(2) layer, and CuO/Cu(OH)(2) ratio decreases wi th the probed depth decreasing, whereas adsorbed water increasing, An electrochemical oxidation-surface transition model about the passivati ng film formation has been proposed.