THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS - SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS

Citation
Ao. Ogunjimi et al., THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS - SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(4), 1995, pp. 263-271
Citations number
11
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing
ISSN journal
09603131
Volume
5
Issue
4
Year of publication
1995
Pages
263 - 271
Database
ISI
SICI code
0960-3131(1995)5:4<263:TAPFAC>2.0.ZU;2-#
Abstract
This paper reports recent results from an experimental and theoretical programme addressing the issues in the assembly of joints constructed using random and ordered array anisotropic conductive adhesive materi als. The paper presents initial theoretical models of the early stages of the assembly process to assist understanding of the process variab les. Complementary experimental work is presented which explores the e volution of conductivity with processing conditions. Initial results a re presented on the assembly of a novel ordered array material. The pa per closes by drawing the results of the experimental and theoretical work together and presents suggestions for further work.