Ao. Ogunjimi et al., THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS - SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(4), 1995, pp. 263-271
This paper reports recent results from an experimental and theoretical
programme addressing the issues in the assembly of joints constructed
using random and ordered array anisotropic conductive adhesive materi
als. The paper presents initial theoretical models of the early stages
of the assembly process to assist understanding of the process variab
les. Complementary experimental work is presented which explores the e
volution of conductivity with processing conditions. Initial results a
re presented on the assembly of a novel ordered array material. The pa
per closes by drawing the results of the experimental and theoretical
work together and presents suggestions for further work.