E. Koenig et al., CURRENT-TEMPERATURE FEEDBACK EFFECTS IN III-V HETEROJUNCTION BIPOLAR-TRANSISTORS, IEEE journal of solid-state circuits, 31(1), 1996, pp. 122-127
The consequence of the reciprocal relation between the temperature and
current distributions in heterojunction bipolar transistors (HBT's) h
as been determined. The dc current-voltage (I-V) characteristics. RF s
mall-signal parameters, and temperature distributions of discrete devi
ces with emitter fingers of varying lengths were analyzed empirically
and their thermal profiles calculated numerically. The lateral tempera
ture gradient induced in the finger due to power dissipation under nor
mal operating conditions is shown to directly affect the current distr
ibution in the transistor. The negative temperature dependence of the
HBT base-emitter junction turn-on voltage results in positive feedback
between current and temperature. This current-temperature relationshi
p leads to higher localized current densities in the hottest portion o
f the device, the center of the emitter. The temperature of the hot se
ction rises with increasing power dissipation, continually drawing mor
e current. Ultimately, the current through HBT's is localized to a com
parable area at the finger center, independent of the emitter length.