The authors present the results of an investigation which aims to corr
elate the hath deposition composition as electroless copper deposition
parameter with its characteristic properties, such as crystallographi
c texture and roughness. The top surface layer of copper films deposit
ed on copper substrates iso (110) textured when surfactant free bath i
s used, hut (100) orientation prevails for the deposit obtained when a
bath containing surfactant is used. The obtained results suggest that
in the presence of the surfactant the (100) face is blocked.