MODELING OF TRANSIENT LIQUID-PHASE BONDING

Modelling of transient liquid phase (TLP) bonding is reviewed. The out puts produced during analytical and numerical modelling are discussed in detail and compared with actual experimental results produced when joining simple binary alloy systems. The effects of increased diffusiv ity at base material grain boundaries, of grain boundary motion, and o f grain boundary grooving, on isothermal solidification during TLP bon ding are described, There is a critical need for detailed research in which modelling output is closely related to direct microstructural ob servations during bonding of complex alloy systems. (C) 1995 The Insti tute of Materials and ASM International.